RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS130906

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

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RF3930D

Assembly Notes

Die Storage



Individual bare die should be held in appropriately sized ESD waffle trays or ESD GEL packs.



Die should be stored in CDA/N2 cabinets and in a controlled temperature and humidity environment.

Die Handling



Die should only be picked using an auto or semi-automated pick system and an appropriate pick tool.



Pick parameters will need to be carefully defined so not to cause damage to either the top or bottom die surface.



GaN HEMT devices are ESD sensitive materials. Please use proper ESD precautions when handling devices or evaluation

boards.



RFMD does not recommend operating this device with typical drain voltage applied and the gate pinched off in a high

humidity, high temperature environment.

Caution: The use of inappropriate or worn-out ejector needle and improper ejection parameter settings can cause die backside

tool marks or micro-cracks that can eventually lead to die cracking.

Die Attach

There are two commonly applied die attach processes: adhesive die attach and eutectic die attach. Both processes use special

equipment and tooling to mount the die.

EUTECTIC ATTACH



80/20 AuSn preform, 0.5 - 1mil thickness, made from virgin melt gold.



Pulsed heat or die scrub attach process using auto / semi-automatic equipment.



Attach process carried out in an inert atmosphere.



Custom die pick collets are required that match the outline of the die and the specific process employed using either

pulsed, fixed heat, or scrub.



Maximum temperature during die attach should be no greater than 320°C and for less than 30 seconds.



Key parameters that need to be considered include: die placement force, die scrub profile and heat profile.



Minimal amount of voiding is desired to ensure maximum heat transfer to the carrier and no voids should be present

under the active area of the die.



Voiding can be measured using X-ray or Acoustic microscopy.



The acceptable level of voiding should be determined using thermal modeling analysis.

ADHESIVE ATTACH



High thermal silver filled epoxy is dispensed in a controlled manner and die is placed using an appropriate collet.

Assembled parts are cured at temperatures between 150°C and 180°C.



Always refer to epoxy manufacturer's data sheet.



Industry recognized standards for epoxy die attach are clearly defined within MIL-883.

Early Life Screen Conditions

field deployment.