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SGA3363Z 数据表(PDF) 4 Page - RF Micro Devices |
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SGA3363Z 数据表(HTML) 4 Page - RF Micro Devices |
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4 / 6 page ![]() 4 of 6 DS111011 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. SGA3363Z Suggested Pad Layout Package Drawing Dimensions in inches (millimeters) Refer to drawing posted at www.rfmd.com for tolerances. Pin Function Description 3RF IN RF input pin. This pin requires the use of an external DC-blocking capacitor chosen for the frequency of operation. 1, 2, 4, 5 GND Connection to ground. For optimum RF performance, use via holes as close to ground leads as possible to reduce lead inductance. 6RF OUT/BIAS RF output and bias pin. DC voltage is present on this pin, therefor a DC-blocking capacitor is necessary for proper opera- tion. Preliminary Dimensions in inches [millimeters] RF OUT RF I N Notes: 1. Provide a large ground pad area under device pins 1, 2, 4, & 5 with many plated via holes as shown. 2. Dimensions given for 50 Ohm RF I/O lines are for 31 mil thick Getek. Scale accordingly for different board thicknesses and dielectric contants. 3. We recommend 1 or 2 ounce copper. Measure- ments for this data sheet were made on a 31 mil thick Getek with 1 ounce copper on both sides. |
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