Revision DS20150609

Disclaimer: Subject to change without notice

© 2015 RF Micro Devices, Inc.

www.rfmd.com / www.qorvo.com

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RFPA2172

RFMD + TriQuint = Qorvo

PCB Solder Mask Pattern

Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown

for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance

around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to

create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier.

Figure 2. PCB Solder Mask (Top View)

Thermal Pad and Via Design

The PCB metal land pattern has been designed with a thermal pad that matches the die paddle size on the

bottom of the device.

Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern

has been designed to address thermal, power dissipation and electrical requirements of the device as well as

accommodating routing strategies.

The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished

hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a

design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results.