Rev. 7d

 

Polymeric PTC

MERITEK

MPTS Series

(Low Rho)

 

The dimension in the table below provides the recommended pad layout for each MPTS1210 device

 

 

 

 

 

 

 

 

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3

°C/second max.

Preheat :

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Time (tsmin to tsmax)

150

°C

200

°C

60-180 seconds

Time maintained above:

217

°C

60-150 seconds

Peak/Classification Temperature(Tp) :

260

°C

Time within 5

°C of actual Peak :

Temperature (tp)

20-40 seconds

Ramp-Down Rate :

6

°C/second max.

Time 25

°C to Peak Temperature :

8 minutes max.

Solder reflow



Due to “Lead Free” nature, Temperature

and Dwell time for the soldering zone is

higher than those for Non-compliant

parts. This may cause damage to other

components.



Recommended max solder paste

thickness > 0.25mm.



Devices can be cleaned using standard

methods and aqueous solvent.



Rework should utilize standard industry

practices. These changes should apply to

all notes for each case size.



Storage Environment : < 30ºC / 60%RH

Caution:



If reflow temperatures exceed the

recommended profile, devices may not

meet the performance requirements.



Devices are not designed to be wave

soldered to the bottom side of the board.

Pad dimensions (millimeters)

Device

A

Nominal

B

Nominal

C

Nominal

All 1210 Series

2.00

1.00

2.80