BAS40_1PSXXSB4X_SER

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© NXP Semiconductors N.V. 2015. All rights reserved.

Product data sheet

Rev. 9 — 18 March 2015

7 of 22

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

6.

Thermal characteristics

[1]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2]

Reflow soldering is the only recommended soldering method.

[3]

Soldering point at pins 2, 3, 5 and 6.

7.

Characteristics

[1]

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per device

thermal resistance from

junction to ambient

in free air

[1]

SOT23

-

-

500

K/W

SOT143B

-

-

500

K/W

SOT363 (1PS88SB48)

-

-

416

K/W

SOT416

-

-

833

K/W

SOT666 (BAS40-05V)

[2] --

225

K/W

SOT666 (BAS40-07V)

[2] --

416

K/W

SOD123F

[2] --

330

K/W

SOD323

-

-

450

K/W

SOD523

[2] --

450

K/W

SOD882

[2] --

500

K/W

SOT323

-

-

625

K/W

thermal resistance from

junction to solder point

SOT363 (BAS40XY)

[3] --

260

K/W

Table 8.

Characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per diode

forward voltage

[1]

-

-

380

mV

-

-

500

mV

-

-

1

V

reverse current

-

-

1

A

-

-

10

A

diode capacitance

-

-

5

pF