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IRL1404ZPBF 数据表(PDF) 2 Page - International Rectifier

部件名 IRL1404ZPBF
功能描述  Advanced Process Technology
PDF  12 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  IRF [International Rectifier]
网页  http://www.irf.com
标志 IRF - International Rectifier

IRL1404ZPBF 数据表(HTML) 2 Page - International Rectifier

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IRL1404Z/S/LPbF
2
www.irf.com
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11).
‚ Limited by TJmax, starting TJ = 25°C,
L = 0.079mH, RG = 25
Ω, IAS = 75A, VGS =10V.
Part not recommended for use above this value.
ƒ Pulse width ≤ 1.0ms; duty cycle ≤ 2%.
„ Coss eff. is a fixed capacitance that gives the same
charging time as Coss while VDS is rising from 0 to
80% VDSS .
… Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical
repetitive avalanche performance.
† This value determined from sample failure population. 100%
tested to this value in production.
‡ This is only applied to TO-220AB package.
ˆ When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques
refer to application note #AN-994.
‰Calculated continuous current based on maximum allowable
junction temperature. Bond wire current limit is 120A. Note that
current limitations arising from heating of the device leads may
occur with some lead mounting arrangements.
Š All AC and DC test condition based on former Package limited
current of 75A.
S
D
G
S
D
G
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max.
Units
V(BR)DSS
Drain-to-Source Breakdown Voltage
40
–––
–––
V
ΔV(BR)DSS/ΔTJ
Breakdown Voltage Temp. Coefficient
–––
0.034
–––
V/°C
–––
2.5
3.1
RDS(on)
Static Drain-to-Source On-Resistance
–––
–––
4.7
m
Ω
–––
–––
5.9
VGS(th)
Gate Threshold Voltage
1.4
–––
2.7
V
gfs
Forward Transconductance
120
–––
–––
S
IDSS
Drain-to-Source Leakage Current
–––
–––
20
μA
–––
–––
250
IGSS
Gate-to-Source Forward Leakage
–––
–––
200
nA
Gate-to-Source Reverse Leakage
–––
–––
-200
Qg
Total Gate Charge
–––
75
110
Qgs
Gate-to-Source Charge
–––
28
–––
nC
Qgd
Gate-to-Drain ("Miller") Charge
–––
40
–––
td(on)
Turn-On Delay Time
–––
19
–––
tr
Rise Time
–––
180
–––
td(off)
Turn-Off Delay Time
–––
30
–––
ns
tf
Fall Time
–––
49
–––
LD
Internal Drain Inductance
–––
4.5
–––
Between lead,
nH
6mm (0.25in.)
LS
Internal Source Inductance
–––
7.5
–––
from package
and center of die contact
Ciss
Input Capacitance
–––
5080
–––
Coss
Output Capacitance
–––
970
–––
Crss
Reverse Transfer Capacitance
–––
570
–––
pF
Coss
Output Capacitance
–––
3310
–––
Coss
Output Capacitance
–––
870
–––
Coss eff.
Effective Output Capacitance
–––
1280
–––
Source-Drain Ratings and Characteristics
Parameter
Min.
Typ.
Max.
Units
IS
Continuous Source Current
–––
–––
200k
(Body Diode)
A
ISM
Pulsed Source Current
–––
–––
790
(Body Diode)Ù
VSD
Diode Forward Voltage
–––
–––
1.3
V
trr
Reverse Recovery Time
–––
26
39
ns
Qrr
Reverse Recovery Charge
–––
18
27
nC
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
VDS = 40V, VGS = 0V, TJ = 125°C
MOSFET symbol
showing the
integral reverse
p-n junction diode.
VGS = 16V
VGS = -16V
VDS = 32V
Conditions
VGS = 5.0V e
ID = 75A lÃ
VGS = 0V
VDS = 25V
TJ = 25°C, IS = 75A l, VGS = 0V e
TJ = 25°C, IF = 75A l, VDD = 20V
di/dt = 100A/μs e
Conditions
VGS = 0V, ID = 250μA
Reference to 25°C, ID = 1mA
VGS = 10V, ID = 75A elÃ
VDS = VGS, ID = 250μA
VDS = 40V, VGS = 0V
VGS = 4.5V, ID = 40A e
VGS = 5.0V, ID = 40A e
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz
VGS = 0V, VDS = 32V, ƒ = 1.0MHz
VGS = 0V, VDS = 0V to 32V f
VGS = 5.0V e
VDD = 20V
ID = 75A lÃ
RG = 4.0Ω
VDS = 10V, ID = 75Al
ƒ = 1.0MHz



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