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IR213(6,62,63,65,66,67,68)(J&S) & PbF

Absolute Maximum Ratings

Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage

parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are

measured under board mounted and still air conditions.

Recommended Operating Conditions

The input/output logic-timing diagram is shown in Fig. 1. For proper operation the device should be used within the

with all supplies biased at a 15 V differential.

Symbol

Definition

Min

Max

Units

IR213(6,68)

IR21362

High side floating supply voltage

High side floating supply offset voltage

Note 1

600

High side output voltage

Low side output voltage

0

IR213(6,68)

10

20

IR21362

11.5

20

Low side and logic fixed supply

voltage

IR213(6,63,65,66,67)

12

20

Logic ground

-5

5

FAULT output voltage

RCIN input voltage

V

Note 1:

(Please refer to the Design Tip DT97-3 for more details).

Note 2:

All input pins and the ITRIP and EN pins are internally clamped with a 5.2 V zener diode.

Symbol

Definition

Min

Max

Units

High side offset voltage

High side floating supply voltage

-0.3

625

High side floating output voltage

Low side and logic fixed supply voltage

-0.3

25

Logic ground

Low side output voltage

-0.3

Input voltage LIN, HIN, ITRIP, EN

Lower of

RCIN input voltage

FAULT output voltage

V

dV/dt

Allowable offset voltage slew rate

—

50

V/ns

(28 lead PDIP)

—

1.5

(28 lead SOIC)

—

1.6

Package power dissipation

(44 lead PLCC)

—

2.0

W

(28 lead PDIP)

—

83

(28 lead SOIC)

—

78

Thermal resistance, junction to

ambient

(44 lead PLCC)

—

63

°C/W

Junction temperature

—

150

Storage temperature

-55

150

Lead temperature (soldering, 10 seconds)

—

300

°C