Precision, CMOS Analog Switches

10

______________________________________________________________________________________

______________________Chip Topography

7

6

4

5

8

9

32

1

0.058"

1.47mm

0.076"

1.93mm

__Ordering Information (continued)

* Contact factory for dice specifications.

** Contact factory for availability and processing to MIL-STD-883.

PART

TEMP. RANGE

PIN-PACKAGE

MAX318CPA

0°C to +70°C

8 Plastic DIP

MAX318CSA

0°C to +70°C

8 SO

MAX318CJA

0°C to +70°C

8 CERDIP

MAX318C/D

0°C to +70°C

Dice*

MAX318EPA

-40°C to +85°C

8 Plastic DIP

MAX318ESA

-40°C to +85°C

8 SO

MAX318 EJA

-40°C to +85°C

8 CERDIP

MAX318MJA

-55°C to +125°C

8 CERDIP**

MAX319CPA

0°C to +70°C

8 Plastic DIP

MAX319CSA

0°C to +70°C

8 SO

MAX319CJA

0°C to +70°C

8 CERDIP

MAX319C/D

0°C to +70°C

Dice*

MAX319EPA

-40°C to +85°C

8 Plastic DIP

MAX319ESA

-40°C to +85°C

8 SO

MAX319EJA

-40°C to +85°C

8 CERDIP

MAX319MJA

-55°C to +125°C

8 CERDIP**

DIE PAD

MAX317

MAX318

MAX319

1

COM

NC

NC

2

GND

GND

GND

3

V+

V+

V+

4

VL

VL

VL

5

IN

IN

IN

6

V-

V-

V-

7

N.C.

NO

NO

8

N.C.

COM

COM

9

NC

NC

COM

TRANSISTOR COUNT: 32;

SUBSTRATE CONNECTED TO V+.