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FT311D 数据表(PDF) 21 Page - Future Technology Devices International Ltd.

部件名 FT311D
功能描述  USB Android Host IC
PDF  40 Pages
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制造商  FTDI [Future Technology Devices International Ltd.]
网页  http://www.ftdichip.com
标志 FTDI - Future Technology Devices International Ltd.

FT311D 数据表(HTML) 21 Page - Future Technology Devices International Ltd.

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Copyright © 2013 Future Technology Devices International Limited
21
DS_FT311D
USB ANDROID HOST IC Datasheet
Version 1.2
Document No.: FT_000660 Clearance No.: FTDI# 305
7 Absolute Maximum Ratings
The absolute maximum ratings for FT311D are shown in Table 7.1. These are in accordance with the
Absolute Maximum Rating System (IEC 60134). Exceeding these may cause permanent damage to the
device.
Parameter
Value
Unit
Storage Temperature
-65°C to 150°C
Degrees C
Floor Life (Out of Bag) At Factory Ambient
( 30°C / 60% Relative Humidity)
168 Hours
(IPC/JEDEC J-STD-033A MSL Level 3
Compliant)*
Hours
Ambient Temperature (Power Applied)
-40°C to 85°C
Degrees
C.
Vcc Supply Voltage
0 to +3.63
V
VCC_IO
0 to +3.63
V
VCC_PLL_IN
0 to + 1.98
V
DC Input Voltage - USBDP and USBDM
-0.5 to +(Vcc +0.5)
V
DC Input Voltage - High Impedance
Bidirectional
-0.5 to +5.00
V
DC Input Voltage - All other Inputs
-0.5 to +(Vcc +0.5)
V
DC Output Current - Outputs
4
mA
DC Output Current - Low Impedance
Bidirectional
4
mA
Table 7.1 Absolute Maximum Ratings
*
If devices are stored out of the packaging beyond this time limit the devices should be baked
before use. The devices should be ramped up to a temperature of 125°C and baked for up to 17
hours.



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