ICS8543BGI REVISION E NOVEMBER 15, 2012

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©2012 Integrated Device Technology, Inc.

ICS8543I Data Sheet

LOW SKEW, 1-to-4, DIFFERENTIAL-TO-LVDS FANOUT BUFFER

Power Considerations

This section provides information on power dissipation and junction temperature for the ICS8543I.

Equations and example calculations are also provided.

1.

Power Dissipation.

The total power dissipation for the ICS8543I is the sum of the core power plus the power dissipated in the load(s).

NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.

•

2. Junction Temperature.

Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The

maximum recommended junction temperature is 125°C.

The equation for Tj is as follows: Tj =



Tj = Junction Temperature



Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)

In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance



a multi-layer board, the appropriate value is 73.2°C/W per Table 6 below.

Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:

85°C + 0.173W * 73.2°C/W = 97.7°C. This is well below the limit of 125°C.

This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of

board (single layer or multi-layer).



Linear Feet per Minute

0200

500

Single-Layer PCB, JEDEC Standard Test Boards

114.5°C/W

98.0°C/W

88.0°C/W

Multi-Layer PCB, JEDEC Standard Test Boards

73.2°C/W

66.6°C/W

63.5°C/W