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US2175XG-S08-R 数据表(PDF) 7 Page - Unisonic Technologies |
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US2175XG-S08-R 数据表(HTML) 7 Page - Unisonic Technologies |
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7 / 10 page ![]() US2175 CMOS IC UNISONICTECHNOLOGIESCO.,LTD 7 of 10 www.unisonic.com.tw QW-R502-403.C APPLICATION INFORMATION Fault Flag The fault flag mainly protects the system from damage caused by such status as thermal shutdown, overcurrent. Current Limit The current limit function prevents both excessive in-rush current caused by the plug-in events and the short-circuit status for MOSFET switches. The current limit threshold is fixed internally, allowing a 1A minimum current to flow through the MOSFET switches. Thermal Shutdown Both thermal shutdown circuits turn both MOSFET switches off if the temperature rises approximately 135°C, at the same time FLG pin becomes active. 10°C of hysteresis ensures the MOSFETs will not turn on again until the chip temperature is reduced to 125°C. Under overcurrent fault conditions, the thermal shutdown will turn off the MOSFET switch which is in this status due to temperature rise, the other keeps its state. Supply Filtering In order to control supply transients, a bypass capacitor placed between IN pin and GND pin is suggested. 0.1μF to 1μF is suitable. Without a bypass capacitor, an output short may cause sufficient ringing on the input (from supply lead inductance) to damage internal control circuitry. Transient Requirements Ferrite beads are recommended in series with all power and ground connector pins to prevent EMI and excessive in-rush current generated from input capacitance of down stream during a hot plug-in event. The USB devices support dynamic attachment (hot plug-in) of peripherals. . Short Circuit Transient A 33μF/16V tantalum or a 100μF/10V electrolytic capacitor located closely to downstream connector for each port is recommended to provide transient protection and a bulk capacitance provides the short-term transient current needed during a hot-attachment event. Printed Circuit Layout To meet the requirements for power circuitry of USB printed circuit boards, maximum thermal consumption and minimum voltage drop and EMI is required. |
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