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US3602G-S08-R 数据表(PDF) 4 Page - Unisonic Technologies |
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US3602G-S08-R 数据表(HTML) 4 Page - Unisonic Technologies |
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4 / 7 page ![]() US3602 Preliminary CMOS IC UNISONICTECHNOLOGIESCO.,LTD 4 of 7 www.unisonic.com.tw QW-R502-985.b ABSOLUTE MAXIMUM RATING PARAMETER SYMBOL RATINGS UNIT VCC Pin Input Voltage VCC -0.3~20 V Feedback Pin Input Voltage FB -0.3~6 V Internal MOSFET Drain Voltage Drain -0.3~600 V Current Sense Pin Input Voltage CS -0.3~6 V Power Dissipation (Note 2) PDMAX 0.45 W Thermal Resistance (Junction to Ambient) θJA 145 °C/W Operating Junction Temperature TJ -40~150 °C Storage Temperature Range TSTG -55~150 °C Notes: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied. 2. The maximum power dissipation decrease if temperature rise, it is decided by TJMAX, θJA, and environment temperature (TA). The maximum power dissipation is the lower one between PDMAX=(TJMAX-TA)/θJA and the number listed in the maximum table. RECOMMENDED OPERATION CONDITIONS PARAMETER SYMBOL RATINGS UNIT Power Supply Voltage VCC 7.5~14.5 V Output Power (Input Voltage 230V±15%) POUT1 <5 W Output Power (Input Voltage 85V~265V) POUT2 <4 W ELECTRICAL CHARACTERISTICS (Note 1, 2) (VCC=12V, TA=25°C, Unless otherwise specified) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Supply Voltage Section Turn on Threshold Voltage VTH(ON) 13 14 15 V Turn off Threshold Voltage VTH(OFF) 6.5 V VCC OVP Protection VCC_OVP 16 V VCC Clamped Voltage VCC_clamp ICC=10mA 23 V Start up Current IST VCC=VTH(ON)-1V 30 50 µA Operating Current ICC-OP FOP=40kHz 1 mA Current Sense Section Current Sense Threshold Voltage VCS 460 500 600 mV Leading Edge Blanking Time TLEB 500 nS OCP Propagation Delay TD_OC 300 nS Feedback Section FB Voltage Sense Level VFB 1 V Minimum Demagnetization Time TDEMAG_MIN 3.5 µS Line Compensation Ratio (Note 3) ∆VCS/∆IFBUP 1.1 mV/µA Maximum Duty Cycle Maximum Duty Cycle DMAX 50 % Over Temperature Protection Thermal Shutdown Threshold TSD 150 °C Thermal Shutdown Hysteresis TSD-HYS 25 °C MOSFET Section Static Drain-Source On-Resistance RDS_ON VGS=10V/IDS=0.5A 13 Ω Drain-Source Breakdown Voltage BVDSS VGS=0V/IDS=250µA 600 V Drain-Source Leakage Current IDSS VGS=0V/VDS=600V 100 nA Notes: 1. Production testing of the chip is performed at 25°C. 2. The maximum and minimum parameters specified are guaranteed by test, the typical value are guaranteed by design, characterization and statistical analysis. 3. Refer to application information. |
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