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MAX9110 数据表(PDF) 6 Page - Maxim Integrated Products |
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MAX9110 数据表(HTML) 6 Page - Maxim Integrated Products |
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6 / 8 page ![]() Single/Dual LVDS Line Drivers with Ultra-Low Pulse Skew in SOT23 6 _______________________________________________________________________________________ VCC GND DIN_ RL/2 RL/2 VOS VOD DO_- DO_+ Figure 1. LVDS Transmitter VOD and VOS Test Circuit RL CL DO_ + DO_ - CL 50 Ω DIN_ GENERATOR Figure 2. Transmitter Propagation Delay and Transition Time Test Circuit stage presents a symmetrical, high-impedance output, reducing differential reflection and timing distortion. The driver outputs are short circuit current limited and enter a high-impedance state when the device is not powered. LVDS Operation The LVDS interface standard is a signaling method intended for point-to-point communication over a con- trolled impedance medium as defined by the EIA/TIA- 644 LVDS standard. The LVDS standard uses a lower voltage swing than other common communication stan- dards, achieving higher data rates with reduced power consumption while reducing EMI emissions and system susceptibility to noise. LVDS transmitters such as the MAX9110/MAX9112 convert CMOS/LVTTL signals to low-voltage differential signals at rates in excess of 500Mbps. The MAX9110/ MAX9112 current-steering architecture requires a resis- tive load to terminate the signal and complete the trans- mission loop. Because the device switches the direc- tion of current flow and not voltage levels, the actual output voltage swing is determined by the value of the termination resistor at the input of an LVDS receiver. Logic states are determined by the direction of current flow through the termination resistor. With a typical 3.5mA output current, the MAX9110/MAX9112 produce an output voltage of 350mV when driving a 100 Ω load. The steady-state-voltage peak-to-peak swing is twice the differential voltage, or 700mV (typ). Applications Information Supply Bypassing Bypass VCC with high-frequency surface-mount ceramic 0.1µF and 0.001µF capacitors in parallel, as close to the device as possible, with the smaller valued capacitor the closest. For additional supply bypassing, place a 10µF tantalum or ceramic capacitor at the point where power enters the circuit board. 0 VOH VOL DIN_ DO_ - DO_+ VDIFF 3V tPHLD 1.5V 0 tTHL 20% 0 80% 80% 0 tTLH 20% 0V DIFFERENTIAL tPLHD 1.5V VDIFF = VDO_+ - VDO_- Figure 3. Transmitter Propagation Delay and Transition Time Waveforms |
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