MAX985ESA datasheet(2/13 Pages) MAXIM

2 / 13 page

Micropower, Low-Voltage, UCSP/SC70,

Rail-to-Rail I/O Comparators

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC = 2.7V to 5.5V, VEE = 0V, VCM = 0V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Supply Voltage (VCC to VEE) ...................................................6V

IN_-, IN_+ to VEE .......................................-0.3V to (VCC + 0.3V)

OUT_ to VEE

MAX985/MAX989/MAX993 ....................-0.3V to (VCC + 0.3V)

MAX986/MAX990/MAX994.....................................-0.3V to 6V

OUT_ Short-Circuit Duration to VEE or VCC ...........................10s

Continuous Power Dissipation (TA = +70°C)

5-Pin SC70 (derate 3.1mW/°C above +70°C) ...............247mW

5-Pin SOT23 (derate 7.10mW/°C above +70°C)...........571mW

6-Bump UCSP (derate 3.9mW/°C above +70°C)..........308mW

8-Pin SOT23 (derate 9.1mW/°C above +70°C).............727mW

8-Pin µMAX (derate 4.5mW/°C above +70°C) ..............362mW

8-Pin SO (derate 5.88mW/°C above +70°C).................471mW

14-Pin TSSOP (derate 9.1mW/°C above +70°C) ..........727mW

14-Pin SO (derate 8.33mW/°C above +70°C)...............667mW

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Bump Reflow Temperature (Note 1) ................................+235°C

Inferred from PSRR test

CONDITIONS

2.5

5.5

VCC

Supply Voltage

UNITS

MIN

TYP

MAX

SYMBOL

PARAMETER

2.5V

≤ VCC ≤ 5.5V

PSRR

Power-Supply Rejection Ratio

VCC = 5V

±0.5

±5

TA = +25°C

VEE -VCC +

0.25

±3

VHYST

Input Hysteresis

Full common-mode

range

Input Bias Current

(Note 5)

0.001

1.0

CIN

Input Capacitance

CMRR

Common-Mode Rejection Ratio

0.5

IOS

Input Offset Current

±7

VOS

Input Offset Voltage

(Note 4)

VOUT = high

µA

1.0

ILEAK

Output Leakage Current

(MAX986/MAX990/

MAX994 only)

TA = +25°C

TA = -40°C to +85°C

VCC = 2.7V

µA

ICC

Supply Current per

Comparator

TA = +25°C

TA = -40°C to +85°C

Sourcing or sinking,

VOUT = VEE or VCC

ISC

Output Short-Circuit Current

TA = +25°C

TA = -40°C to +85°C

VEE

VCC

VCMR

Common-Mode Voltage

Range (Note 3)

VCC = 5V

VCC = 2.7V

VCC = 5V,

ISINK = 8mA

0.55

0.2

0.4

VOL

OUT Output Voltage Low

VCC = 2.7V,

ISINK = 3.5mA

0.4

0.15

0.3

TA = +25°C

TA = -40°C to +85°C

TA = +25°C

TA = -40°C to +85°C

Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-

mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection Packaging

Reflow. Preheating is required. Hand or wave soldering is not allowed.

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