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PLCC6XW6 数据表(PDF) 7 Page - HB Electronic Components |
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PLCC6XW6 数据表(HTML) 7 Page - HB Electronic Components |
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7 / 12 page ![]() Technical Data Sheet Top View LED Prepared date:Sep. 2011 Rev.:3 Page 7 of 12 ◆ Soldering Pad Dimensions: ◆ Soldering Conditions (Maximum allowable soldering conditions) • Reflow soldering should not be done more than two times. Unit:mm Tolerance:±0.2mm • Do not stress its resin while soldering. • After soldering, do not warp the circuit board. • Pay attention to electrostatic(ESD). Hebei I.T. (Shanghai) Co., Ltd. www.ledz.com |
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