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MMSZ5259B 数据表(PDF) 1 Page - Micro Commercial Components |
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MMSZ5259B 数据表(HTML) 1 Page - Micro Commercial Components |
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1 / 4 page ![]() Features l Planar Die construction l 500mW Power Dissipation l Zener Voltages from 2.4V - 39V l Ideally Suited for Automated Assembly Processes Mechanical Data l Case: SOD-123, Molded Plastic l Terminals: Solderable per MIL-STD-202, Method 208 l Approx. Weight: 0.008 grams l Mounting Position: Any l Storage & Operating Temperature: -55 oC to +150oC Maximum Ratings @ 25oC Unless Otherwise Specified Zener Current IF 100 mA Maximum Forward Voltage VF 1.2 V Power Dissipation (No te s A) P(AV) 500 mWatt Pe ak Forward S urge IFSM 4.0 Amps NOTES: MMSZ5221B THRU MMSZ5259B 500 mW Zener Diodes 2.4 to 39 Volts MCC www.mccsemi.com A. Mounted on 5.0mm2(.013mm thick) land areas. B. Measured on 8.3ms, single half sine-wave or equivalent Current (Not e s B) square wave, duty cycle = 4 pulses per minute maximum. INCHES MM DIM MIN MAX MIN MAX NOTE A .141 .154 3.60 3.90 B .098 .110 2.50 2.80 C .055 .071 1.40 1.80 D .037 .053 0.95 1.35 E .019 .028 0.50 0.70 F --- .008 --- 0.20 G .016 --- 0.40 --- 1.50” 2.0" 1.50” SUGGESTED SOLDER PAD LAYOUT A B E C H D F G SOD123 DIMENSIONS omponents 21201 Itasca Street Chatsworth !"# $% !"# H --- .005 --- 0.12 MAX |
类似零件编号 - MMSZ5259B |
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类似说明 - MMSZ5259B |
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