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MIC2753-RBM5 数据表(PDF) 4 Page - Micrel Semiconductor

部件名 MIC2753-RBM5
功能描述  Power Supply Supervisors Preliminary Information
PDF  12 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  MICREL [Micrel Semiconductor]
网页  http://www.micrel.com
标志 MICREL - Micrel Semiconductor

MIC2753-RBM5 数据表(HTML) 4 Page - Micrel Semiconductor

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MIC2753/2754
Micrel
MIC2753/2754
4
June 1999
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
OL(RST)
Reset Output Voltage Low
R/S/T voltage codes,
0.5
V
MIC2753
V
IN = VTHU(max) + 100mV, ISINK = 50µA
L/M voltage codes,
0.5
V
V
IN = VTHU(max) + 100mV, ISINK = 50µA
V
OH(RST)
Reset Output Voltage High
R/S/T voltage codes,
V
IN –0.5
V
MIC2753
V
IN = VTHU(min) – 100mV, ISOURCE = 0.5mA
L/M voltage codes,
V
IN –0.8
V
V
IN = VTHU(min) – 100mV, ISOURCE = 1.0mA
V
OL(RST)
/Reset Output Voltage Low
R/S/T voltage codes,
0.5
V
MIC2754
V
IN = VTHU(min) – 100mV, ISINK = 0.5mA
L/M voltage codes,
0.8
V
V
IN = VTHU(min) – 100mV, ISINK = 1.0mA
V
IN ≥ 1.5V, IOL = 50µA
0.5
V
V
OH(RST)
/Reset Output Voltage High
R/S/T voltage codes,
V
IN –0.5
V
MIC2754
V
IN = VTHU(max) + 100mV, ISOURCE = 35µA
L/M voltage codes,
V
IN –0.5
V
V
IN = VTHU(max) + 100mV, ISOURCE = 35µA
V
IH(/MR)
/MR Input Voltage, High
0.8 V
IN
V
V
IL(/MR)
/MR Input Voltage, Low
0.2 V
IN
V
t
PROP(/MR)
Propagation Delay
V
/MR ≤ VIL to VRST ≥ VOH
1
2
µs
MIC2753
Propagation Delay
V
/MR ≤ VIL to V/RST ≤ VOL
1
2
µs
MIC2754
t
/MR(min)
/MR Minimum Input Pulse Width
2.5
µs
I
PU
Pull-Up Current, /MR
V
/MR = 0V
0.2
2
µA
I
IH
Input Current, /MR
V
/MR = VIN
0.01
µA
V
OL(/HV)
/HV Output Voltage Low
V
IN > VTHO(max),
0.5
V
I
SINK = 0.5mA, R/S/T voltage codes
V
V
IN > VTHO(max),
0.8
V
I
SINK = 1.0mA, L/M voltage codes
V
t
PROP(/HV)
/HV Propagation Delay
V
IN = VTHO (min) – 100mV to VTHO (max) + 100mV
12
30
µs
I
/HV
/HV Leakage Current
V
IN = VTHO (min) – 100mV
–2
+2
µA
Note 1.
Exceeding the absolute maximum rating may damage the device.
Note 2.
The device is not guaranteed to function outside its operating rating.
Note 3.
Devices are ESD sensitive. Handling precautions recommended.
Note 4.
Final test on outgoing product is performed at T
A = 25°C. Device performance over –40°C ≤ TA ≤ +85°C is guaranteed by design.



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