TC1187 datasheet(3/16 Pages) MICROCHIP

3 / 16 page

DS21353B-page 3

TC1070/TC1071/TC1187

TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATION

S (CONTINUED)

Electrical Characteristics: VIN =VOUT +1V, IL =0.1mA,CL =3.3µF, SHDN >VIH,TA = 25°C, unless otherwise noted. Boldface

type specifications apply for junction temperatures of -40°C to +125°C.

Symbol

Parameter

Min

Typ

Max

Units

Test Conditions

SHDN Input

VIH

SHDN Input High Threshold

——

%VIN

VIN =2.5V to6.5V

VIL

SHDN Input Low Threshold

—

%VIN

VIN =2.5V to6.5V

ADJ Input

IADJ

Adjust Input Leakage Current

—

Note

Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range

from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal

regulation specification.

Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.

Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or

line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., TA,TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate

thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.

6: The minimum VIN has to justify the conditions: VIN ≥ VR +VDROPOUT and VIN ≥ 2.7V for IL =0.1mA to IOUT

MAX.

TC VOUT =(VOUTMAX –VOUTMIN)x 10

VOUT x ∆T

TC1187 数据表(PDF) 3 Page - Microchip Technology

TC1187 数据表(HTML) 3 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

数据表下载