TC1306 datasheet(2/16 Pages) MICROCHIP

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TC1306

DS21527B-page 2

1.0

ELECTRICAL

CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS*

Input Voltage .........................................................6.5V

Output Voltage........................... (-0.3V) to (VIN +0.3V)

Power Dissipation................Internally Limited (Note 7)

Maximum Voltage on Any Pin ......... VIN +0.3V to -0.3V

Operating Temperature Range.... -40°C < TJ < +125°C

Storage Temperature Range .............. -65°C to +150°C

*Stresses above those listed under "Absolute Maximum

Ratings" may cause permanent damage to the device. These

are stress ratings only and functional operation of the device

at these or any other conditions above those indicated in the

operation sections of the specifications is not implied.

Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability.

TC1306 ELECTRICAL SPECIFICATIONS

Electrical Characteristics: VIN =VR +1V, IL =100µA, CL =3.3µF, SHDN1 >VIH, SHDN2 >VIH,TA = 25°C, unless otherwise noted.

Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2.

Symbol

Parameter

Min

Typ

Max

Units

Test Conditions

VIN

Input Operating Voltage

2.7

—

6.0

Note 1

IOUTMAX

Maximum Output Current

150

—

Per Channel

VOUT

Output Voltage (VOUT1 and VOUT2)

VR –2.5%

VR ±0.5% VR +2.5%

Note 2

TCVOUT

VOUT Temperature Coefficient

—

ppm/°C Note 3

∆VOUT/∆VIN Line Regulation

—

0.05

0.35

%(VR +1V) < VIN < 6V

∆VOUT/VOUT Load Regulation

—

0.3

%IL = 0.1mA to IOUTMAX

(Note 4)

VIN – VOUT

Dropout Voltage

—

125

—

120

240

360

IL =100µA

IL =50mA

IL =100mA

IL =150mA, (Note 5)

IIN

Supply Current

—

120

200

µA

SHDN1, SHDN2 =VIH,IL =0

IINSD

Shutdown Supply Current

—

0.05

0.5

µA

SHDN1, SHDN2 =0V

PSRR

Power Supply Rejection Ratio

—

FRE ≤ 120Hz

IOUTSC

Output Short Circuit Current

—

450

—

VOUT =0V

∆VOUT∆PD

Thermal Regulation

—

0.04

—

V/W

Notes 6, 7

tWK

Wake Up Time

(from Shutdown Mode)

—10

—

µsec

VIN =5V

CIN =1µF, COUT =4.7µF

IL = 30mA, (See Figure 4-1)

Settling Time

(from Shutdown Mode)

—40

—

µsec

VIN =5V

CIN =1µF, COUT =4.7µF

IL = 30mA, (See Figure 4-1)

Note 1:

The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN =VR +VDROPOUT.

VR is the regulator output voltage setting. For example: VR =2.8V, 3.0V.

Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from

0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation

specification.

Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V

differential.

Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or

line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., TA,TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate

thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details.

TC VOUT =(VOUTMAX –VOUTMIN)x 10

VOUT x ∆T

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