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PIC16LC710-10/SP 数据表(PDF) 91 Page - Microchip Technology |
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PIC16LC710-10/SP 数据表(HTML) 91 Page - Microchip Technology |
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91 / 176 page  © 1997 Microchip Technology Inc. DS30272A-page 91 PIC16C71X Applicable Devices 710 71 711 715 11.2 DC Characteristics: PIC16LC710-04 (Commercial, Industrial, Extended) PIC16LC711-04 (Commercial, Industrial, Extended) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature 0˚C ≤ TA ≤ +70˚C (commercial) -40˚C ≤ TA ≤ +85˚C (industrial) -40˚C ≤ TA ≤ +125˚C (extended) Param No. Characteristic Sym Min Typ† Max Units Conditions D001 Supply Voltage Commercial/Industrial Extended VDD VDD 2.5 3.0 - - 6.0 6.0 V V LP, XT, RC osc configuration (DC - 4 MHz) LP, XT, RC osc configuration (DC - 4 MHz) D002* RAM Data Retention Voltage (Note 1) VDR - 1.5 - V D003 VDD start voltage to ensure internal Power- on Reset signal VPOR - VSS - V See section on Power-on Reset for details D004* VDD rise rate to ensure internal Power-on Reset signal SVDD 0.05 - - V/ms See section on Power-on Reset for details D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled D010 D010A D015 Supply Current (Note 2) Brown-out Reset Current (Note 5) IDD ∆IBOR - - - 2.0 22.5 300* 3.8 48 500 mA µA µA XT, RC osc configuration FOSC = 4 MHz, VDD = 3.0V (Note 4) LP osc configuration FOSC = 32 kHz, VDD = 3.0V, WDT disabled BOR enabled VDD = 5.0V D020 D021 D021A D021B D023 Power-down Current (Note 3) Brown-out Reset Current (Note 5) IPD ∆IBOR - - - - - 7.5 0.9 0.9 0.9 300* 30 5 5 10 500 µA µA µA µA µA VDD = 3.0V, WDT enabled, -40 °C to +85°C VDD = 3.0V, WDT disabled, 0 °C to +70°C VDD = 3.0V, WDT disabled, -40 °C to +85°C VDD = 3.0V, WDT disabled, -40 °C to +125°C BOR enabled VDD = 5.0V * These parameters are characterized but not tested. † Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered without losing RAM data. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD MCLR = VDD; WDT enabled/disabled as specified. 3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS. 4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti- mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm. 5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. |
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