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SHT3X 数据表(PDF) 9 Page - List of Unclassifed Manufacturers |
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SHT3X 数据表(HTML) 9 Page - List of Unclassifed Manufacturers |
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9 / 13 page ![]() Datasheet SHT3x-ARP www.sensirion.com May 2015 - Version 0.93 9/13 5.2 Package Outline Figure 11 Dimensional drawing of SHT3x-ARP sensor package Parameter Symbol Min Nom. Max Units Comments Package height A 0.8 0.9 1 mm Leadframe height A3 0.2 mm Not shown in the drawing Pad width b 0.2 0.25 0.3 mm Package width D 2.4 2.5 2.6 mm Center pad length D2 1 1.1 1.2 mm Package length E 2.4 2.5 2.6 mm Center pad width E2 1.7 1.8 1.9 mm Pad pitch e 0.5 mm Pad length L 0.3 0.35 0.4 mm Max cavity S 1.5 mm Only as guidance. This value includes all tolerances, including displacement tolerances. Typically the opening will be smaller. Center pad marking T1xT2 0.3x45° mm indicates the position of pin 1 Table 7 Package outline 5.3 Land Pattern Figure 12 shows the land pattern. The land pattern is understood to be the metal layer on the PCB, onto which the DFN pads are soldered. The solder mask is understood to be the insulating layer on top of the PCB covering the copper traces. It is recommended to design the solder mask as a Non- Solder Mask Defined (NSMD) type. For NSMD pads, the solder mask opening should provide a 60 μm to 75 μm design clearance between any copper pad and solder mask. As the pad pitch is only 0.5 mm we recommend to have one solder mask opening for all 4 I/O pads on one side. For solder paste printing it is recommended to use a laser-cut, stainless steel stencil with electro-polished trapezoidal walls and with 0.1 or 0.125 mm stencil thickness. The length of the stencil apertures for the I/O pads should be the same as the PCB pads. However, the position of the stencil apertures should have an offset of 0.1 mm away from the center of the package. The die pad aperture should cover about 70 – 90 % of the die pad area –thus it should have a size of about 0.9 mm x 1.6 mm. For information on the soldering process and further recommendation on the assembly process please consult the Application Note HT_AN_SHTxx_Assembly_of_SMD_Packages , which can be found on the Sensirion webpage. D S A D2 L T1 x T2 |
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