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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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GF2000 数据表(PDF) 1 Page - List of Unclassifed Manufacturers |
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GF2000 数据表(HTML) 1 Page - List of Unclassifed Manufacturers |
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1 / 2 page  Gap Filler 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material properties and good compression set (memory).The result is a soft, form-in- place elastomer ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease.After cure, it won’t pump from the interface as a result of thermal cycling and is dry to the touch. Unlike cured Gap Filling materials, the liquid approach offers infinite thickness with little or no stress during displacement and assembly. It also eliminates the need for specific pad thickness and die-cut shapes for individual applications. Gap Filler 2000 is intended for use in thermal interface applications when a strong structural bond is not required. As cured, Gap Filler 2000 is formulated to have pliable low-modulus, properties. Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Filler 2000 (Two-Part) TYPICAL APPLICATIONS INCLUDE • Automotive electronics • Telecommunications • Computer and peripherals • Thermally conductive vibration dampening • Between any heat-generating semiconductor and a heat sink CONFIGURATIONS AVAILABLE • Supplied in cartridge and kit form PDS_GF_2000_0913 FEATURES AND BENEFITS • Thermal conductivity: 2.0 W/m-K • Ultra-conforming, designed for fragile and low-stress applications • Ambient and accelerated cure schedules • 100% solids – no cure by-products • Excellent low and high temperature mechanical and chemical stability PRODUCT DESCRIPTION Thermally Conductive, Liquid Gap Filling Material September 2013 PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD Color / Part A Pink Pink Visual Color / Part B White White — Viscosity as Mixed (cps)(1) 300,000 300,000 ASTM D2196 Density (g/cc) 2.9 2.9 ASTM D792 Mix Ratio 1:1 1:1 — Shelf Life @ 25°C (months) 6 6 — PROPERTY AS CURED Color Pink Pink Visual Hardness (Shore 00)(2) 70 70 ASTM D2240 Heat Capacity (J/g-K) 1.0 1.0 ASTM D1269 Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 — ELECTRICAL AS CURED Dielectric Strength (V/ml) 500 500 ASTM D149 Dielectric Constant (1000 Hz) 7 7 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL AS CURED Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470 CURE SCHEDULE SCHEDULE 1 SCHEDULE 2 SCHEDULE 3 Pot Life @ 25°C (3) 15 min 60 min 600 min (10 hr) Cure @ 25°C (4) 1-2 hours 3-4 hours 3 days Cure @ 100°C (4) 5 min 15 min 1 hour 1) Brookfield RV,Heli-Path,Spindle TF @ 20 rpm, 25°C. 2) Thirty second delay value Shore 00 hardness scale. 3) Time for viscosity to double. 4) Cure schedule (rheometer - time to read 90% cure) TYPICAL PROPERTIES OF GAP FILLER 2000 |
类似零件编号 - GF2000 |
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类似说明 - GF2000 |
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