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TPS61253 数据表(PDF) 4 Page - Texas Instruments

部件名 TPS61253
功能描述  TPS6125x 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging
PDF  33 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

TPS61253 数据表(HTML) 4 Page - Texas Instruments

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TPS61253, TPS61254, TPS61256, TPS61258, TPS61259
SLVSAG8E – SEPTEMBER 2011 – REVISED MARCH 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Input voltage
Voltage at VIN(2), VOUT(2), SW(2), EN(2), BP(2)
–0.3
7
V
Continuous average current into SW (3)
1.8
Input current
A
Peak current into SW (4)
3.5
Power dissipation
Internally limited
Operating, TA
(5)
–40
85
Temperature
Operating virtual junction, TJ
–40
150
°C
Storage, Tstg
–65
150
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2)
All voltages are with respect to network ground terminal.
(3)
Limit the junction temperature to 105°C for continuous operation at maximum output power.
(4)
Limit the junction temperature to 125°C for 5% duty cycle operation.
(5)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (
θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is
recommended to operate the device with a maximum junction temperature of 105°C.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-
±1000
V(ESD)
Electrostatic discharge
V
C101(2)
Machine model (MM)
±200
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
7.3 Recommended Operating Conditions
MIN
NOM
MAX
UNIT
TPS61253
2.65(1)
4.85
TPS61254
2.5
4.35
TPS61256
2.5
4.85
VI
Input voltage range
V
TPS61257
2.5
4.15
TPS61258
2.65(1)
4.35
TPS61259
2.65(1)
4.85
RL
Minimum resistive load for start-up
TPS6125x
55
Ω
L
Inductance
0.7
1.0
2.9
µH
CO
Output capacitance
3.5
5
50
µF
TA
Ambient temperature
–40
85
°C
TJ
Operating junction temperature
–40
125
°C
(1)
Up to 1000mA peak output current.
4
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Copyright © 2011–2015, Texas Instruments Incorporated
Product Folder Links: TPS61253 TPS61254 TPS61256 TPS61258 TPS61259



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