Si APD

S10341 series

3

Terminal capacitance vs. reverse voltage

Excess noise factor vs. gain

0

50

100

150

0.1

100

(Typ. Ta=25 °C, f=1 MHz)

1

10

S10341-05

S10341-02

Gain

11

0

1

10

100

KAPDB0193EB

KAPDB0022EB

· After unpacking, store this device in an environment at a

temperature of 30 °C and a humidity below 60%, and perform

reflow soldering on this device within 24 hours.

· Thermal stress applied to the device during reflow soldering

differs depending on the PC boards and reflow oven being

used.

· When setting the reflow conditions, make sure that the reflow

soldering process does not degrade device reliability.

Recommended solder reflow condition

Time (s)

0

50

100

150

200

250

0

50

100

300

250

200

150

Peak temperature 235°C max.

KAPDB0194EA