MSC0994.PDF

ISO 9001 CERTIFIED

REV F 10/27/99

8700 E. Thomas Road

Scottsdale, AZ 85251

Tel: (480) 941-6300

Fax: (480) 947-1503

Description

In Microsemi's Powermite

provide power-handling capabilities found in larger packages. In addition to

its size advantages, Powermite

bottom that eliminates the possibility of solder flux entrapment during

assembly, and a unique locking tab acts as an integral heat sink. Its

innovative design makes this device ideal for use with automatic insertion

equipment.

Features

•

Surface Mount Packaging

•

Integral Heat Sink Locking Tabs

•

Compatible with automatic insertion equipment

•

Full metallic bottom eliminates flux entrapment

•

Zener voltage 1.8 to 100V

•

Low noise

•

Low reverse leakage current

•

Tight tolerance available

Maximum Ratings

•

Junction and storage temperatures: -55

°C to +150°C

•

DC power dissipation: 1 watt

•

Forward voltage:

@ 200 mA 1.1 volts

Mechanical Specifications

Mounting Pad Dimensions

POWERMITE

®

LOW NOISE 1 WATT

Zener Diodes

1PMT4614 thru 1PMT4627

and

1PMT4099 thru 1PMT4135

Mechanical Characteristics

•

Cathode designated by TAB 1

•

Mounting position any way

•

Molded package

•

Weight: 0.016 gram (approximate)

•

Thermal resistance 30°C/W junction to

TAB 1

Packaging

•

Tape & Reel EIA Standard 481

CIRCUIT DIAGRAM

DO-216

Inches

All dimensions +/- .005 inches