LX5121

PRODUCT DA T ABOOK 1996/1997

Copyright © 1999

Rev. 1.0

5/99

2

UltraMAX

2.65

2.85

V

12

20

mA

635

670

mA

50

150

µA

-20

-22

-24

mA

-10

µA

-10

µA

1µA

35

MHz

7mA

Termination Voltage

V

TERM

High Level Disable Input Voltage

V

IH

Low Level Disable Input Voltage

V

IL

Operating Virtual Junction Temperature Range

LX5121C

RECOMMENDED OPERATING CONDITIONS

(Note 2)

Parameter

Symbol

Units

Recommended Operating Conditions

Min.

Typ.

Max.

4.0

5.5

V

2V

TERM

V

0

0.8

V

0

125

°C

Note 2. Range over which the device is functional.

ELECTRICAL CHARACTERISTICS

Term Power = 4.75V unless otherwise specified. Unless otherwise specified, these specifications apply at the recommended operating ambient tempera-

ture of T

A

= 25°C. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.

Parameter

Symbol

Test Conditions

Units

LX5121

Min.

Typ.

Max.

Output High Voltage

V

OUT

TermPwr Supply Current

I

CC

All data lines = open

All data lines = 0.2V

Disable Pins 1 & 2 < 0.8V

Output Current

I

OUT

V

Disable Input Current

DISC1

I

IN

DISC1 = 0V

DISC2

DISC2 = 0V

Output Leakage Current

DISC1 and DISC2= < 0.8V, V

Channel Bandwidth

BW

Termination Sink Current, per Channel

I

SINK

V

ABSOLUTE MAXIMUM RA TINGS

(Note 1)

TermPwr Voltage ..................................................................................................... 7V

Continuous Output Voltage Range .............................................................. 0 to 5.5V

Continuous Disable Voltage Range .............................................................. 0 to 5.5V

Operating Junction Temperature

Plastic (DB Packages) .................................................................................... 150ºC

Storage Temperature Range ............................................................. -65°C to +150°C

Solder Temperature (Soldering, 10 seconds) ................................................... 300°C

Note 1. Exceeding these ratings could cause damage to the device.

P ACKAGE PIN OUTS

DB PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

50°C/W

Junction Temperature Calculation: T

J

= T

A

+ (P

D

x

θ

JA

).

The

θ

system. All of the above assume no ambient airflow.

THERMAL DA T A

DB PACKAGE

(Top View)

T27

T26

T25

T18

N1

T17

T16

T15

N.C.

GND

GND

GND

GND

V

T

T14

T13

T12

N.C.

N.C.

T11

T24

T23

T19

T20

T1

T2

W1

W2

T3

T4

T5

GND

GND

GND

GND

DISC1

DISC2

T6

T7

T8

T9

T10

T21

T22

144

243

342

441

540

639

738

837

936

10

35

11

34

12

33

13

32

14

31

15

30

16

29

17

28

18

27

19

26

20

25

21

24

22

23