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MM196 数据表(PDF) 1 Page - Microsemi Corporation |
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MM196 数据表(HTML) 1 Page - Microsemi Corporation |
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1 / 1 page  Microsemi Santa Ana Division 2830 S. Fairview Street, CA. 92704, 714-979-8220, Fax: 714-557-5989 Page 1 Copyright 2000 MSC1589.PDF ,2000-09-20 MM196 6 MOSFET Multi-Chip Module PRELIMINARY SPECIFICATION SAN T A ANA DIV I S I ON DESCRIPTION The MM196 is a Multi-Chip Module, MCM, incorporating 6 independent MOSFET die into a convenient BGA package. This device is also available as discrete individual packaged Powermite3, see Microsemi data sheet UPF1N100. This device is also available as bare die, see Microsemi data sheet MSAFA1N100D. The MM196 allows users to externally connect the MOSFETs via a motherboard or next assembly substrate into any configuration desired. Custom variations of this product incorporating other Microsemi protection die and/or passive components are available by contacting the factory. IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com INDIVIDUAL COM P ONENT INDIVIDUAL COM P ONENT INDIVIDUAL COM P ONENT INDIVIDUAL COM P ONENT SP ECIFI CAT IONS SP ECIFI CAT IONS SP ECIFI CAT IONS SP ECIFI CAT IONS Components Manufacturer Part Number Q1 – Q6 Microsemi Santa Ana MSAFA1N100D Characteristics Note: Refer to individual data sheets for component performance. If there are conflicting requirements, this document takes precedence. Ma xi mu m Ra tin g s @ 25 ºC Ma xi mu m Ra tin g s @ 25 ºC Ma xi mu m Ra tin g s @ 25 ºC Ma xi mu m Ra tin g s @ 25 ºC ( U N L ES S O T H E R W IS E SP EC I F I E D ) Parameter S y m b o l Min Max Unit Peak Repetitive Drain to Source Voltage VDSS 1000 V Operating Temperature Range Top 10 55 º C Ma xi mu m Ra tin g s @ 25 ºC Ma xi mu m Ra tin g s @ 25 ºC Ma xi mu m Ra tin g s @ 25 ºC Ma xi mu m Ra tin g s @ 25 ºC ( U N L ES S O T H E R W IS E SP EC I F I E D ) Description C o n d it ion s TYP Max Unit Drain-Source On-State Resistance, RDS(ON)1 VGS = 10 Vdc, ID= 1 mAdc 12.5 13.5 ohm Drain-Source On-State Resistance, RDS(ON)2 VGS= 7 Vdc, ID= 5…150 mAdc TC= 37º C 12.5 ohm KEY FEATURE S KEY FEATURE S KEY FEATURE S KEY FEATURE S !"Miniature size, Multi-Chip Module, MCM !"Convenient mounting, Ball Grid Array, BGA !"Sn63/Pb37 solder bumps (Alternate attach methods available) !"Maximum switch voltage 1000V APPLICATIONS/BENEFIT APPLICATIONS/BENEFIT APPLICATIONS/BENEFIT APPLICATIONS/BENEFITS SS S !"Three phase switching !"AC-DC converters !"Applications utilizing multiple MOSFET die in multiple or array configurations Schematic Configuration and Dimensions Top View 0.38” typical Microsemi MM196 0.35” typical 0.050” max |
类似零件编号 - MM196 |
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类似说明 - MM196 |
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