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MXP3003 数据表(PDF) 1 Page - Microsemi Corporation |
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MXP3003 数据表(HTML) 1 Page - Microsemi Corporation |
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1 / 1 page ![]() Microsemi Opto Electronics Products Group 2830 S. Fairview Street, Santa Ana, CA 92704, (714) 979-8220 Fax (714)966-5256 http://www.microsemi.com/opto Page 1 Copyright 2000 MSC1592.PDF 2000-10-16 MXP3000 Series GaAs PIN Photodiode Chips PRODUCT PREVIEW O PT O E LE CT RON I C P RO DUC TS DESCRIP T ION DESCRIP T ION DESCRIP T ION DESCRIP T ION Microsemi’s GaAs PIN Photodiode chips are ideal for wide bandwidth 850nm optical networking applications. The five devices offered feature excellent dark current ratings of 1-3 nA, and a breakdown voltage of 20 Volts with the bandwidth options for 1.4 GHz (active area of 250 mm 2), 1.75 GHz(active area of 200 mm 2), 5 GHz (active area of 100 mm 2), 7 GHz (active area of 60 mm 2), and 8.75 GHz (active area of 30 mm 2), The MXP3000 series of photodiodes are originally offered in die form for manufacturers of photodiode modules, supervisory pump laser circuits, and combination PIN Photodiode-transimpedance amplifier hybrids. IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com KEY FEATURE S KEY FEATURE S KEY FEATURE S KEY FEATURE S !"Low Dark Current !"Extremely low capacitance !"Wide bandwidth !"Fast response time APPLICATIONS/BENEFIT APPLICATIONS/BENEFIT APPLICATIONS/BENEFIT APPLICATIONS/BENEFITS SS S !"850nm Fiber Optic Applications Part Ratings and Characteristics Item Sym MXP3001 MXP3002 MXP3003 MXP3004 MXP3005 Unit Test Condition Active Area(Dia.) — 30 60 100 200 250 mm2 — Photo Sensitive Area 0.0007 0.0028 0.0078 0.0314 0.0491 mm2 Detection Range — 850 850 850 850 850 Nm — Responsivity R 0.45 0.45 0.45 0.45 0.45 A/W VR=-5V, l = 850nm Dark Current Idark 1 1 1 2 3 nA VR=-5V Capacitance C 0.3 0.4 0.6 1.5 2 pF VR=-5V Rise/Fall Time tr/tf 40 50 70 200 250 ps VR=-5V, @ 850nm Bandwidth 8.75 7 5 1.75 1.4 GHz VR=-5V, @ 850nm Breakdown Voltage VB 20 20 20 20 20 IR=10uA Chip Size 350 x 350 350 x 350 350 x 350 500 x 500 500 x 500 um x um Bonding Pad Size 40 x 100 40 x 100 100 100 100 um x um |
类似零件编号 - MXP3003 |
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类似说明 - MXP3003 |
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