SM5002L series

NIPPON PRECISION CIRCUITS—3

PAD LAYOUT

(Unit :

µm)

PINOUT

(Top View)

PIN DESCRIPTION and PAD DIMENSIONS

BLOCK DIAGRAM

Chip size: 0.92

× 1.31 mm

Chip thickness: 400 ± 30 µm

Q

VDD

XT

VSS

(0,0)

(920,1310)

X

Y

INH

XT

1

XT

VSS

Q

VDD

4

2

3

NC

NC

8

7

6

5

XT

INH

Number

Name

I/O

Description

Pad dimensions [µm]

XY

1

INH

I

Output state control input. Oscillator stopped when LOW. Power-saving pull-up

resistor built in

195

188

2

XT

I

Amplifier input.

Crystal oscillator connection pins.

Crystal oscillator connected between XT and XT

385

188

3XT

O

Amplifier output.

575

188

4

VSS

–

Ground

766

188

5

Q

O

Output. Output frequency. High impedance at standby operation

765

1159

6

NC

–

No connection

–

–

7

NC

–

No connection

–

–

8

VDD

–

Supply voltage

162

1159

XT

VSS

VDD

Q

XT

INH