CC8

www.vishay.com

Vishay Electro-Films

Revision: 05-Apr-13

2

Document Number: 61007

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS in inches

SCHEMATIC

MECHANICAL SPECIFICATIONS

PARAMETER

VALUE

Chip Size

0.020" x 0.020" ± 0.003" (0.5 mm x 0.5 mm ± 0.08 mm)

Chip Thickness

0.010" ± 0.002" (0.25 mm ± 0.05 mm)

Chip Substrate Material

99.6 % alumina, 2 μ" to4 μ" finish

Resistor Material

Nichrome

Bonding Pad Size

0.004" x 0.008" (0.10 mm x 0.20 mm) minimum

Number of Pads

2

Pad Material

25 k

 minimum gold standard

Passivation

Thermalset plastic

Backing

None

GLOBAL PART NUMBER INFORMATION

GLOBAL PART NUMBER: CC8-12500KKSSNHWS

GLOBAL PART NUMBER DESCRIPTION: CC8 1.25K 10 % 100 ppm Std SnPb None H WS

MODEL

RESISTANCE

RESISTANCE

MULTIPLIER

CODE

TOLERANCE

CODE

TCR

(ppm/°C)

TRIM

STYLE

TERMINATION

BACK

METAL

VISUAL

CLASS

PACK CODE

17

CC8-

First 4 digits

are significant

figures of

resistance

B = 0.01

A = 0.1

0 = 1

1 = 10

B = 0.1 %

C = 0.25 %

D = 0.5 %

F = 1.0 %

G = 2.0 %

J = 5.0 %

K = 10 %

E = ± 25

C = ± 50

K = ± 100

E = Edg

S = Std

U = Usr

N = Nitride

G = Au

S = SnPb

A = Al

T = Lead

(Pb)-free (e1)

G = Au

N = None

H = Class H

K = Class K

WS = Waffle

pack 100 min.,

1 mult

0.008

0.020

0.004

0.020

TYPICAL RANGE

110

Ω to 20 kΩ

0.015

0.020

0.020

0.004

TYPICAL RANGE

20

Ω to 100 Ω

25

0

K

S

S

K

-

NH

8

CC

1

WS

0