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LR 数据表(PDF) 1 Page - Vishay Siliconix |
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LR 数据表(HTML) 1 Page - Vishay Siliconix |
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1 / 3 page ![]() LR www.vishay.com Vishay Dale Thin Film Revision: 24-Jul-13 1 Document Number: 20055 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Lead (Pb)-Free Thick Film, Wraparound Low Value Resistor (R = 0.25 ) FEATURES • Metal glaze on high quality ceramic • Protective overglaze • Lead (Pb)-free solder contact on Ni barrier layer • Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes e3 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 Note (1) CECC 40401-802/EIA-575 DERATING Note (2) Limits for change of resistance at test. Available STANDARD ELECTRICAL SPECIFICATIONS MODEL CASE SIZE INCH CASE SIZE METRIC POWER RATING (1) P70 W LIMITING ELEMENT VOLTAGE MAX. V TEMPERATURE COEFFICIENT ± ppm/°C TOLERANCE ± % RESISTANCE VALUE LR 2512 6332 2.0 300 1 0.25 P x R TECHNICAL SPECIFICATIONS PARAMETER UNIT 2512 Power rating W 2.0 Limiting element voltage V Insulation voltage (1 min) Vpeak > 300 Thermal resistance K/W 45 Insulation resistance > 109 Temperature range °C - 55 to + 125 Weight/1000 pieces g 40.5 P x R Ambient Temperature in °C 0 80 100 0 40 100 70 20 40 60 140 20 60 80 125 PERFORMANCE TEST CONDITIONS OF TEST REQUIREMENTS (2) Endurance test at 70 °C IEC 60115-1, 4.25.1 1000 h at 70 °C, 1.5 h “ON”, 0.5 h “OFF” ± 2 % Endurance at UCT IEC 60115-1, 4.25.3 1000 h at 125 °C without load ± 0.5 % Overload test IEC 60115-1, 4.13 Short time overload for 2 s ± 1 % Thermal shock IEC 60115-1, 4.19; IEC 60068-2-14 Rapid change between upper and lower category temperature ± 1 % Damp heat steady state IEC 60115-1, 4.24; IEC 60068-2-3 56 days at 40 °C and 93 % relative humidity ± 2 % Resistance to soldering heat IEC 60115-1, 4.18; IEC 60068-2-20 10 s at 260 °C solder bath temperature ± 1 % |
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