MIF

www.vishay.com

Vishay Electro-Films

Revision: 02-May-13

2

Document Number: 61038

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS in inches

SCHEMATIC

0.016

0.020

0.012

0.005

MECHANICAL SPECIFICATIONS

PARAMETER

Chip Size

0.016" x 0.020" ± 0.003" (0.40 mm x 0.5 mm ± 0.076 mm)

Chip Thickness

0.010" ± 0.001" (0.25 mm ± 0.025 mm)

Chip Substrate Material

99.6 % alumina, 2 μ" to 4 μ" finish

Resistor Material

Tantalum nitride, self-passivating

Bonding Pad Size

0.005" x 0.012" (0.125 mm x 0.30 mm)

Number of Pads

2

Pad Material

25 kÅ minimum gold standard

Backing

None

GLOBAL PART NUMBER INFORMATION

Global Part Number: MIF5000BKKMGNHWS

Global Part Number Description: MIF 50 10 %, 100 ppm/°C, Mic trim, Au term, no back metal, class H, WS

MODEL

RESISTANCE

RESISTANCE

MULTILPLIER

CODE

TOL.

CODE

(%)

TCR

(ppm/°C)

TRIM

STYLE

TERMINATION

BACK

METAL

VISUAL

CLASS

PACKAGING

CODE

MIF

20 x 16

size

microwave

resistor

TaN on

alumina

First 4

digits are

significant

figures of

resistance

B = 0.01

A = 0.1

0 = 1

F = 1.0

G = 2.0

H = 2.5

J = 5.0

K = 10

M = 20

K = ± 100

L = ± 200

R = 0/- 250

M =

Microwave

S =

Standard

G = Au

G = Au

N = None

H =

Class H

K =

Class K

WS =

Waffle pack

100 min,

1 mult

00

B

K

M

G

N

K

5

HW

F

MI

0

S