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PFRR 数据表(PDF) 2 Page - Vishay Siliconix |
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PFRR 数据表(HTML) 2 Page - Vishay Siliconix |
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2 / 6 page ![]() PFRR www.vishay.com Vishay Revision: 19-Nov-14 2 Document Number: 53046 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Note • Suggested land pattern: According to IPC-7351 TRACEABILITY DEFINITIONS The two major traceability elements are defined as: • The primary process lot number named Front End lot (FE lot). One “FE lot”is composed of several wafers issued from the same thin film deposition sequence. • The date code named Batch Number(BN). The “BN” is defined after completion of the end of production testing sequence. The lot homogeneity is given by the “FE lot” and not by the “BN”. According to the applied rules validated by the ESCC through the product qualification, the following situations are agreed: • Parts coming from different “FE lost” might have the same “BN”. • A maximum of two different “BN” might be applied to the same “FE lot” to enable the use of overruns from a previous PO. • Unless requested / approved by the customer the “BN” will be 2 years old maximum. SPECIFIC TRACEABILITY REQUIREMENTS The following specific requirements have to be treated as: • A customer who requires “Lot Homogeneity” has to mention it on the PO as “SINGLE PRODUCTION LOT”. • A customer who requires “Lot Homogeneity” in addition to a “Single Batch Number” has to mention it on the PO as “SINGLE PRODUCTION LOT AND OPTION R0101”. END OF PRODUCTION TESTING Mandatory testing performed at the end of the production process: • 100 % overload: Voltage or 2 UL whichever is less - duration 2 s DIMENSIONS in millimeters VARIANT NUMBER STYLE AB C D E Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. 09 0603 1.39 2.16 0.62 1.01 0.25 1.02 0.17 0.51 0.25 0.51 10 0805 1.78 2.55 1.14 1.53 0.25 1.02 0.17 0.51 0.25 0.51 11 1206 2.87 3.64 1.47 1.86 0.25 1.02 0.17 0.51 0.25 0.51 12 2010 4.95 5.72 2.41 2.8 0.25 1.02 0.35 0.85 0.35 0.85 15 0402 0.87 1.64 0.47 0.86 0.25 1.02 0.09 0.38 0.12 0.38 LAND PATTERN DIMENSIONS in millimeters CHIP SIZE Zmax. Gmin. Xmax. 0402 1.55 0.15 0.73 0603 2.37 0.35 0.98 0705/0805 2.76 0.74 1.40 1206 3.91 1.85 1.73 2010 5.93 3.71 2.67 A D D C E E B G min. Z max. 6.25 P n x Rn |
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