PR01, PR02, PR03

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Vishay BCcomponents

Revision: 10-Sep-15

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Document Number: 28729

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PR02 Temperature rise (

T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

PR03 Temperature rise (

T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

PR03 Temperature rise (

T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

PR03 Temperature rise (

T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

ΔT

(K)

P (W)

15 mm

20 mm

25 mm

80

0

20

40

60

0

1.8

2.2

0.6

0.2 0.4

0.8

1.2

1.6

2.0

1.4

1.0

Ø 0.78 mm FeCu-leads



Minimum distance from resistor body to PCB = 1 mm

Ø 0.78 mm Cu-leads



Minimum distance from resistor body to PCB = 1 mm

100

01

3

0

2

20

40

60

80

∆T

(K)

P (W)

15 mm

20 mm

25 mm

Ø 0.58 mm FeCu-leads



Minimum distance from resistor body to PCB = 1 mm

01

3

2

ΔT

(K)

P (W)

15 mm

10 mm

20 mm

25 mm

80

0

20

40

60

Ø 0.78 mm FeCu-leads



Minimum distance from resistor body to PCB = 1 mm

0

1.6

3.2

2.4

0.8

ΔT

(K)

P (W)

15 mm

20 mm

80

0

20

40

60