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ACE712E 数据表(PDF) 7 Page - ACE Technology Co., LTD. |
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ACE712E 数据表(HTML) 7 Page - ACE Technology Co., LTD. |
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7 / 8 page ![]() ACE712E 5V/2A Output, 1MHz Synchronous Step-Up Converter with DCP emulator VER 1.1 7 THERMAL CONSIDERATIONS As the ACE712E has a power MOSFET with internal current limit up to 5A, heat dissipation is always needed to be considered when designing the PCB for such high-power step-up converter. ACE712E employs a package of DFN3x3-12 with only 3 OC/W thermal resistance from chip to its thermal pad. So it is crucial for one to lay a large area of copper (in most case, it is the large ground plane), directly contacting the thermal pad of the chip through more than 2 large vias from bottom, to spread the heat away to the ambient environment as fast as possible. A thicker copper foil is always recommended to help the heat dissipation, so a PCB with 2oz copper thickness is a much better choice than that of 1oz copper. PACKAGE OUTLINE DFN3x3-12 |
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