QFX

www.vishay.com

Vishay Electro-Films

Revision: 05-Apr-13

2

Document Number: 61031

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS in inches

SCHEMATIC

MECHANICAL SPECIFICATIONS

PARAMETER

VALUE

Chip Size

0.050" x 0.050" ± 0.003" (1.25 mm x 1.25 mm ± 0.75 mm)

Chip Thickness

0.010" ± 0.002" (0.254 mm ± 0.05 mm)

Chip Substrate Material

Quartz

Resistor Material

Tantalum nitride, self-passivating

Bonding Pad size

0.005" x 0.005" (0.127 mm x 0.127 mm)

Number of Pads

2

Pad Material

10 kÅ minimum aluminum (Au optional)

Backing

None, lapped quartz

GLOBAL PART NUMBER INFORMATION

Global Part Number: QFX25003KR4GGKWS

Global Part Number Description: QFX 2.5M 10 % 0/- 250 ppm/°C 40 Au Au K WS

MODEL

RESISTANCE

RESISTANCE

MULTILPLIER

CODE

TOL.

CODE

(%)

TCR

(ppm/°C)

SIZE

TERMINATION

BACK

METAL

VISUAL

CLASS

PACKAGING

CODE

QFX

High value

TaN on

Quartz

First 4

digits are

significant

figures of

resistance

2 = 100

3 = 1000

4 = 10 000

B = 0.1

C = 0.25

D = 0.5

F = 1.0

G = 2.0

J = 5.0

K = 10.0

E = ± 25

C = ± 50

K = ± 100

M = ± 250

W = ± 350

R = 0/- 250

P = 0/- 350

I = 0/- 200

3 = 30 x 30

4 = 40 x 40

5 = 55 x 55

G = Au

A = Al

G = Au

N = None

H =

Class H

K =

Class K

WS =

Waffle pack

100 min.,

1 mult

0.050

0.045

0.050

0.005

0.005

003

K

4

G

G

R

2

KW

X

QF

5

S