SFM

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Vishay Electro-Films

Revision: 25-Feb-13

2

Document Number: 61017

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

CONFIGURATIONS in inches

SCHEMATIC

MECHANICAL SPECIFICATIONS

PARAMETER

VALUE

Chip Size

0.020" x 0.020" ± 0.003" (0.5 mm x 0.5 mm ± 0.076 mm)

Chip Thickness

0.010" ± 0.002" (0.254 mm ± 0.05 mm)

Chip Substrate Material

Resistor Material

Tantalum nitride, self-passivating

Bonding Pad Size

0.004" x 0.004" (0.10 mm x 0.10 mm)

Number of Pads

2

Pad Material

25 kÅ minimum aluminum

Backing

None, lapped semiconductor silicon

GLOBAL PART NUMBER INFORMATION

Global Part Number: SFM50000FKANHWS

Global Part Number Description: SFM 5K 1 %, 100 ppm/°C, Al, no back metal, class H, WS

MODEL

RESISTANCE

RESISTANCE

MULTIPLIER

CODE

TOLERANCE

CODE

(%)

TCR

(ppm/°C)

TERMINATION

BACK

METAL

VISUAL

CLASS

PACKAGING

CODE

SFM

First 4 digits are

significant figures

of resistance

C = 0.001

B = 0.01

A = 0.1

0 = 1

1 = 10

2 = 100

3 = 1000

B = 0.1

C = 0.25

D = 0.5

F = 1.0

G = 2.0

H = 2.5

J = 5.0

K = 10

E = ± 25

C = ± 50

K = ± 100

M = ± 250

R = 0/- 250

G = Au

A = Al

G = Au

N = None

H = Class H

K = Class K

WS = Waffle pack

100 min, 1 mult

Historical Part Number: WSFM04550000F (will continue to be accepted)

0.016

0.004

0.007

TYPICAL RANGE

1

Ω to 29 Ω

0.004

0.020

0.006

TYPICAL RANGE

30

Ω to 819 Ω

0.020

0.020

0.004

TYPICAL RANGE

820

Ω to 1 MΩ

0.016

0.004

00

0

F

A

N

H

K

5

WS

M

SF

0