SFN

www.vishay.com

Vishay Electro-Films

Revision: 11-Sep-13

2

Document Number: 61025

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS in inches

SCHEMATIC

TYPICAL RANGE

10

Ω to 55 Ω

0.004

0.014

TYPICAL RANGE

56

Ω to 7.4 kΩ

0.004

0.008

TYPICAL RANGE

7.5 k

Ω to 510 kΩ

0.004

0.020

0.020

0.004

MECHANICAL SPECIFICATIONS

PARAMETER

VALUE

Chip Size

0.010" ± 0.002" (0.254 mm ± 0.05 mm)

Chip Thickness

0.020" x 0.020" ± 0.003" (0.51 mm x 0.51 mm ± 0.05 mm)

Chip Substrate Material

Resistor Material

Nichrome (passivation optional)

Bonding Pad Size

0.004" x 0.004" (0.10 mm x 0.10 mm)

Number of Pads

2

Pad Material

15 kÅ minimum gold (Al optional)

Backing

None, lapped semiconductor silicon (Au back optional)

GLOBAL PART NUMBER INFORMATION

Global Part Number: SFN50000FKANHWS

Global Part Number Description: SFN 5K 1 % 100 ppm Al None H WS

MODEL

RESISTANCE

RESISTANCE

MULTIPLIER

CODE

TOLERANCE

CODE

(%)

TCR

(ppm/°C)

TERMINATION

BACK

METAL

VISUAL

CLASS

PACKAGING

CODE

SFN

20 x 20

size NiCr

on

Silicon

First 4 digits are

significant figures

of resistance

B = 0.01

A = 0.1

0 = 1

1 = 10

2 = 100

3 = 1000

B = 0.1

C = 0.25

D = 0.5

F = 1.0

G = 2.0

J = 5.0

K = 10

B = ± 10

E = ± 25

C = ± 50

K = ± 100

M = ± 250

G = Au

A = Al

G = Au

N = None

H = Class H

K = Class K

WS = Waffle pack

100 min, 1 mult

FW = Full wafer

000

F

A

N

H

K

5

WS

N

SF

0