SFP

www.vishay.com

Vishay Electro-Films

Revision: 04-Mar-13

2

Document Number: 61000

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS in inches

SCHEMATIC

TYPICAL RANGE

< 30

Ω

PART MARK

TYPICAL RANGE

30

Ω to 199 Ω

PART MARK

TYPICAL RANGE

200

Ω to 1 kΩ

PART MARK

TYPICAL RANGE

1 k

Ω to 1 MΩ

PART MARK

0.004

0.022

0.018

0.005

STANDARD MARKING - 5 DIGITS

XXXX

X

Four significant digits of value

Multiplier

C = 0.001

B = 0.01

A = 0.1

0 = 0

1 = 10

2 = 100

3 = 1000

MECHANICAL SPECIFICATIONS

PARAMETER

VALUE

Chip Size

0.022" x 0.022" ± 0.003" (0.558 mm x 0.558 mm ± 0.05 mm)

Chip Thickness

0.010" ± 0.002" (0.254 mm ± 0.05 mm)

Chip Substrate Material

Resistor Material

Tantalum nitride, self-passivating

Bonding Pad Size

0.004" x 0.004" (0.10 mm x 0.10 mm)

Number of Pads

2

Pad Material

25 kÅ minimum aluminum (Au optional)

Backing

None, lapped semiconductor silicon (Au optional)

GLOBAL PART NUMBER INFORMATION

Global Part Number: SFP50000FKANHWS

Global Part Number Description: SFP 5K 1 % 100 ppm/°C Al None H WS

MODEL

RESISTANCE

RESISTANCE

MULTIPLIER

CODE

TOLERANCE

CODE

(%)

TCR

(ppm/°C)

TERMINATION

BACK

METAL

VISUAL

CLASS

PACKAGING

CODE

SFP

22 x 22

size

Ta2N on

Silicon

w/ part

mark

First 4 digits

are significant

figures of

resistance

C = 0.001

B = 0.01

A = 0.1

0 = 1

1 = 10

2 = 100

3 = 1000

B = 0.1

C = 0.25

D = 0.5

F = 1.0

G = 2.0

J = 5.0

K = 10.0

E = ± 25

C = ± 50

K = ± 100

M = ± 250

G = Au

A = Al

G = Au

N = None

H = Class H

K = Class K

WS =

Waffle pack

100 min., 1 mult

00

0

F

A

N

H

K

5

WS

P

SF

0