SFX

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Vishay Electro-Films

Revision: 04-Mar-13

2

Document Number: 61018

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

SCHEMATIC

DIMENSIONS in inches (millimeters)

AB

± 0.002 (± 0.05)

± 0.002 (± 0.05)

0.030 (0.76)

0.027 (0.69)

0.040 (1.01)

0.037 (0.94)

0.055 (1.40)

0.052 (1.32)

A

B

0.005

0.005

MECHANICAL SPECIFICATIONS

PARAMETER

VALUE

Chip Size

Per table above

Chip Thickness

0.010" ± 0.002" (0.254 mm ± 0.050 mm)

Chip Substrate Material

Resistor Material

Tantalum nitride, self-passivating

Bonding Pad Size

0.005" x 0.005" (0.127 mm x 0.127 mm)

Number of Pads

2

Pad Material

10 kÅ minimum aluminum (gold pads available)

Backing

None, lapped semiconductor silicon (gold back available)

GLOBAL PART NUMBER INFORMATION

Global Part Number: SFX25003KR4GGKWS

Global Part Number Description: SFX 2.5M 10 % 0 ppm/°C/- 250 ppm/°C 40 Au Au K WS

MODEL

RESISTANCE

RESISTANCE

MULTIPLIER

CODE

TOLERANCE

CODE

TCR

(ppm/°C)

SIZE

TERMINATION

BACK

METAL

VISUAL

CLASS

PACKAGING

CODE

SFX

High

value

TaN on

silicon

The first

4 digits are

significant

figures of

resistance

2 = 100

3 = 1000

4 = 10 000

B = 0.1 %

C = 0.25 %

D = 0.5 %

F = 1.0 %

G = 2.0 %

J = 5.0 %

K = 10.0 %

E = ± 25

C = ± 50

K = ± 100

M = ± 250

W = ± 350

I = 0/- 200

R = 0/- 250

P = 0/- 350

3 = 30 x 30

4 = 40 x 40

5 = 55 x 55

G = Au

A = Al

G = Au

N = None

H = Class H

K = Class K

WS =

Waffle pack,

100 min,

1 mult

250

0

K

R

4

3

X

SF

GG

K

W

S