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100331 数据表(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部件名 100331
功能描述  Low Power Triple D Flip-Flop
PDF  8 Pages
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制造商  NSC [National Semiconductor (TI)]
网页  http://www.national.com
标志 NSC - National Semiconductor (TI)

100331 数据表(HTML) 4 Page - National Semiconductor (TI)

  100331 Datasheet HTML 1Page - National Semiconductor (TI) 100331 Datasheet HTML 2Page - National Semiconductor (TI) 100331 Datasheet HTML 3Page - National Semiconductor (TI) 100331 Datasheet HTML 4Page - National Semiconductor (TI) 100331 Datasheet HTML 5Page - National Semiconductor (TI) 100331 Datasheet HTML 6Page - National Semiconductor (TI) 100331 Datasheet HTML 7Page - National Semiconductor (TI) 100331 Datasheet HTML 8Page - National Semiconductor (TI)  
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AC Electrical Characteristics
V
EE = −4.2V to −5.7V, VCC = VCCA = GND
Symbol
Parameter
T
C = −55˚C
T
C = +25˚C
T
C = +125˚C
Units
Conditions
Notes
Min
Max
Min
Max
Min
Max
f
max
Toggle Frequency
400
400
400
MHz
Figures 2, 3
(Note
10)
t
PLH
Propagation Delay
0.50
2.20
0.60
2.00
0.50
2.40
ns
t
PHL
CP
C to Output
Figures 1, 3
t
PLH
Propagation Delay
0.50
2.20
0.60
2.00
0.50
2.40
ns
t
PHL
CP
n to Output
t
PLH
Propagation Delay
0.50
2.20
0.60
2.00
0.50
2.40
CP
n,CPC = L
Figures
1, 4
(Notes
7, 8,
9)
t
PHL
CD
n,SDn to Output
ns
t
PLH
0.50
2.40
0.60
2.10
0.50
2.50
CP
n,CPC = H
t
PHL
t
PLH
Propagation Delay
0.70
2.70
0.80
2.60
0.80
2.90
CP
n,CPC = L
t
PHL
MS, MR to Output
ns
t
PLH
0.70
2.90
0.80
2.80
0.80
3.10
CP
n,CPC = H
t
PHL
t
TLH
Transition Time
0.20
1.40
0.20
1.40
0.20
1.40
ns
Figures 1, 3, 4
t
THL
20% to 80%,80% to 20%
t
s
Setup Time
Figure 5
(Note
10)
D
n
1.00
0.80
0.90
CD
n,SDn (Release Time)
1.50
1.30
1.60
ns
Figure 4
MS, MR (Release Time)
2.50
2.30
2.50
t
h
Hold Time D
n
1.50
1.30
1.60
ns
Figure 5
t
pw(H)
Pulse Width HIGH
CP
n,CPC,CDn,
2.00
2.00
2.00
ns
Figures 3, 4
SD
n, MR, MS
Note 7: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately
without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case
condition at cold temperatures.
Note 8: Screen tested 100% on each device at +25˚C. Temperature only, Subgroup A9.
Note 9: Sample tested (Method 5005, Table I) on each Mfg. lot at +25˚C, Subgroup A9, and at +125˚C, and −55˚C Temp., Subgroups A10 and A11.
Note 10: Not tested at +25˚C, +125˚C and −55˚C Temperature (design characterization data).
www.national.com
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