4

Package Specification

PACKAGE DIMENSIONS IN mm (INCHES)

Ordering Information

Part Number

Description

CS464H

Flip-Chip

CS464YDW16

16 Lead SO Wide

CS464YDWR16

16 Lead SO Wide (tape & reel)

PACKAGE THERMAL DATA

D

Lead Count

Metric

English

Max

Min

Max

Min

16 Lead SO Wide

10.50

10.10

.413

.398

Thermal Data

16 Lead SO Wide

typ

23

°C/W

typ

105

°C/W

Bump Locations, Bump Side Up

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Semiconductor Components Industries, LLC (SCILLC). ON

Semiconductor reserves the right to make changes without

further notice to any products herein. For additional infor-

mation and the latest available information, please contact

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© Semiconductor Components Industries, LLC, 2000

Surface Mount Wide Body (DW); 300 mil wide

1.27 (.050) BSC

7.60 (.299)

7.40 (.291)

10.65 (.419)

10.00 (.394)

D

0.32 (.013)

0.23 (.009)

1.27 (.050)

0.40 (.016)

REF: JEDEC MS-013

2.49 (.098)

2.24 (.088)

0.51 (.020)

0.33 (.013)

2.65 (.104)

2.35 (.093)

0.30 (.012)

0.10 (.004)

.525

± .05

.0302 MAX

13X .095

± .045

13X .165

± .038

1.022

CA

MB

CR

.496

2.39

.356

.431

1.021

1.020

1.022

.279

.382

1.017

2.14

0

0

0

0

CS-464

Flip-Chip

CS

S

OUT

IC

D

Gnd

IN-

IN+

Test

Note: All dimensions in millimeters.

Flip-Chip