5

4

1

3

2

+

-

OUT

V

-

IN+

V

+

IN-

LPV521

www.ti.com

SNOSB14D – AUGUST 2009 – REVISED DECEMBER 2014

5 Pin Configuration and Functions

SC70-5 Top View

Pin Functions

PIN

TYPE

DESCRIPTION

NO.

NAME

1

OUT

O

Output

2

V-

P

Negative Power Supply

3

IN+

I

Noninverting Input

4

IN-

I

Inverting Input

5

V+

P

Positive Power Supply

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

−0.3

6

V

IN+, IN-, OUT Pins

V

40

mA

–300

300

mV

–40

150

°C

Mounting Temperature

Infrared or Convection (30 sec.)

260

°C

Wave Soldering Lead Temp. (4 sec.)

260

°C

−65

150

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage may occur. Recommended Operating Conditions indicate conditions

for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and test

conditions, see the Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX),

θJA. The maximum allowable power dissipation at any ambient temperature

is PD = (TJ(MAX) – TA)/

θJA. All numbers apply for packages soldered directly onto a PC Board.

6.2 ESD Ratings

VALUE

UNIT

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

Electrostatic discharge

V

Machine Model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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