WAFER LEVEL PACKAGING

Data Sheet

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DS720H

Rev Date: 1/16

Package Options

Ball Loading

Pitch

Sphere Diameter

0.50 mm

0.30 mm

0.40 mm

0.25 mm

0.30 mm

0.20 mm

Reliability Qualification

Package Level:

• Preconditioning at Level 1 85°C/85% RH, 168 hours,

(Unlimited out of bag life)

reflow @ 260°C peak

• Temp Cycle

-55°C/+125°C, 1000 cycles

• High Temp Storage

150°C, 1000 hours

Board Level:

• Temp Cycle 

-40°C/+125°C, 15 min. ramp rate, ≥ 500 cycles

• Drop Test 

JEDEC condition B (1500G), ≥ 100 drops

WLPTest

DPS

• Design services available

– Layout

– Mask tooling

• Wafer RDL patterning and

bumping (ball sphere loaded

or plated)

• Automated Optical Inspection

(AOI) for best in class quality

assurance

• Wafer map generation

• Test software and hardware

development

• Probe card design, service

and support

• Test program transfer

• Wafer sort for RF, memory,

logic and analog applications

• Best in class singulated device

edge quality for all Si nodes

• Shipping material design and

supply management

• Drop ship to final customer

available

Contact Probe

Inspect & Clean

PBO or PI 1

RDL Seed Deposition

Resist Processing

Cu RDL Plating

Resist & Seed Removal

PBO or PI 2

UBM Seed Deposition

Resist Processing

Cu or Ni-based UBM

Resist & Seed Removal

Ball Place

Backgrind

Backside Lamination

Laser Mark

Singulation

Tape & Reel

AOI

Process Highlights

• Die thickness

150 µm* to 450 µm

• Bump height

0.5 mm Pitch: 250 µm

0.4 mm Pitch: 210 µm

0.3 mm Pitch: 170 µm

• Solder ball pitch (ball loaded)

0.28, 0.3, 0.35, 0.4, 0.5 mm

Pitch (plated)

0.12 to 0.25 mm

• Solder sphere diameter

0.2, 0.25, 0.3 mm

• Redistribution trace/space (min)

CSPnl: 12/12 µm

CSPn3: 15/15 µm

• Via diameter (min)

PBO: 15 µm

Polyimide: 25 µm

• Backside laminate (black)

Available

• Saw street (min)

65 µm (passivation free space)

Standard Materials

• Dielectric materials

PBO and polyimide,

cure polymers, low cure polymers

• RDL metalization

Plated copper

• UBM

Thick Cu or Ni-based

• Solder composition (ball loaded)

Pb-free SAC alloys

(plated)

Sn/Ag Pb-free, Cu pillar

Shipping

Carrier tape

7″, 13″ reels

*Advanced manufacturing rules may be required. Contact Amkor Business Unit

for additional information.

Capabilities and Services

WLCSP