TL331

SLVS238G – AUGUST 1999 – REVISED JANUARY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

0

36

V

–36

36

V

Input voltage range (either input)

–0.3

36

V

Output voltage

0

36

V

Output current

0

20

mA

Unlimited

Operating virtual junction temperature

–40

150

°C

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to the network ground.

(3)

Differential voltages are at IN+ with respect to IN–.

(4)

7.2 ESD Ratings

VALUE

UNIT

±1000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

2

36

V

Junction Temperature

-40

125

°C

7.4 Thermal Information

TL331

DBV

UNIT

5 PINS

Junction-to-ambient thermal resistance

218.3

Junction-to-case (top) thermal resistance

87.3

Junction-to-board thermal resistance

44.9

°C/W

Junction-to-top characterization parameter

4.3

Junction-to-board characterization parameter

44.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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