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REF1925 数据表(PDF) 23 Page - Texas Instruments |
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REF1925 数据表(HTML) 23 Page - Texas Instruments |
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23 / 31 page ![]() C C C VREF VIN REF DIG1 Microcontroller A/D Input Via to GND Plane Via to Input Power Analog Input VBIAS GND EN REF V+ GND OUT IN- IN+ AIN C C REF1925, REF1930, REF1933, REF1941 www.ti.com SBOS697 – SEPTEMBER 2014 12 Layout 12.1 Layout Guidelines Figure 54 shows an example of a PCB layout for a data acquisition system using the REF1930. Some key considerations are: • Connect low-ESR, 0.1- μF ceramic bypass capacitors at VIN, VREF, and VBIAS of the REF1930. • Decouple other active devices in the system per the device specifications. • Using a solid ground plane helps distribute heat and reduces electromagnetic interference (EMI) noise pickup. • Place the external components as close to the device as possible. This configuration prevents parasitic errors (such as the Seebeck effect) from occurring. • Minimize trace length between the reference and bias connections to the INA and ADC to reduce noise pickup. • Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible and only make perpendicular crossings when absolutely necessary. 12.2 Layout Example Figure 54. Layout Example Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 23 Product Folder Links: REF1925 REF1930 REF1933 REF1941 |
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