REF5010, REF5020, REF5025, REF5030

REF5040, REF5045, REF5050

www.ti.com

SBOS410G – JUNE 2007 – REVISED NOVEMBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

–0.2

18

V

Output short circuit

–30

30

mA

Operating temperature

–55

125

°C

150

°C

–65

150

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

7.2 ESD Ratings

VALUE

UNIT

±3000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

(1)

18

V

–10

10

mA

(1)

7.4 Thermal Information

REF50xx

D (SOIC)

DGK (VSSOP)

UNIT

8 PINS

8 PINS

Junction-to-ambient thermal resistance

115

160.9

°C/W

Junction-to-case (top) thermal resistance

63.4

53.9

°C/W

Junction-to-board thermal resistance

57.1

82.3

°C/W

Junction-to-top characterization parameter

15.4

5.1

°C/W

Junction-to-board characterization parameter

56.2

80.7

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

Copyright © 2007–2015, Texas Instruments Incorporated

Submit Documentation Feedback

5

Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050