1

2

3

4

8

7

6

5

DNC

(1)

NC

(2)

TRIM/NR

DNC

(1)

V

IN

TEMP

GND

V

OUT

REF50xx

(1) DNC = Do not connect.

(2) NC = No internal connection.

NOTES:

REF5020-EP, REF5025-EP, REF5040-EP, REF5050-EP

www.ti.com

SBOS471B – APRIL 2010 – REVISED JUNE 2015

5 Pin Configuration and Functions

D Package

8- Pin SOIC

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

DNC

1

—

Do not connect

VIN

2

Power

capacitor from 1 µF up to 10 µF

TEMP

3

O

Temperature monitoring pin provides a temperature-dependent voltage output

GND

4

Power

System ground

Output adjustment and noise reduction input. Connecting 1 µF to this pin will create low pas

TRIM/NR

5

I

filter at the bandgap and reduce output noise

Very accurate, factory-trimmed voltage output. Recommended bypass capacitor from 1 µF

VOUT

6

O

up to 50 µF with ESR between 1 and 1.5

Ω

NC

7

—

No internal connection

DNC

8

—

Do not connect

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

18

V

Output short-circuit

30

mA

Operating temperature

–55

125

°C

150

°C

–65

150

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

6.2 ESD Ratings

VALUE

UNIT

±3000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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