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AS3955 数据表(PDF) 2 Page - ams AG

部件名 AS3955
功能描述  NFC Forum Compliant Dynamic Tag
PDF  111 Pages
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制造商  AMSCO [ams AG]
网页  http://www.ams.com
标志 AMSCO - ams AG

AS3955 数据表(HTML) 2 Page - ams AG

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Page 2
ams Datasheet
Document Feedback
[v1-01] 2015-Apr-29
AS3955 − General Description
Key Benefits & Features
The benefits and features of AS3955, NFC Forum compliant
Dynamic Tag are listed below:
Figure 1:
Added Value of Using AS3955
Benefits
Features
• NFC Forum compliance for full interoperability
• Type 2 Tag standalone functionality
• Type 4 Tag emulation with external MCU
• NFC Forum compliance
• ISO 14443A compliance up to Level 4
• Operating frequency at 13.56 MHz
• Bit rate at 106 kbps
• 7-byte UID
• Choice of memory size based on application
• 2 kbit EEPROM (216 bytes of user data) or
• 4 kbit EEPROM (472 bytes of user data)
• Allows zero-power standby
• Configurable passive wake-up interrupt
• Enables long battery life time, or battery-less
designs
• Energy harvesting to supply up to 5mA @ 4.5V
(regulated)
• Allows fast antenna prototyping (ISO antenna
classes 1 to 6)
• 45 pF integrated resonant capacitor
• Design flexibility, easy integration. Fits
requirements for various embedded applications
• 3/4-wire SPI slave interface up to 5 Mbps
• I²C slave interface up to 1 Mbps
• Design flexibility, easy integration
• Programmable I²C address
• Fits supply requirements for various applications,
including industrial
• Wide interface supply range (1.65V to 5.5V)
• Support for multiple applications, and storage of
sensitive data
• 32-bit password memory protection
• High performance and robust data
communication, allows custom protocols to be
implemented
• Tunneling and Extended modes for MCU
communication
• Consistent NFC behavior of battery supplied
devices in e.g. pairing applications
• Silent mode (MCU power status detection),
configurable between 1.42V and 3.65V
• Possibility to disable RF communication
• Configurable Chip Kill mode
• Small outline, compatibility to common inlay and
card manufacturing lines, surface-mount
assembly
• Sawn wafer
• WL-CSP package
• 10-pin MLPD 3x3mm package



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