EM3581-RTR datasheet(52/59 Pages) SILABS

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EM358x

Rev 1.0

6.1.1. QFN48 Footprint Recommendations

Figure 6.3 demonstrates the IPC-7351 recommended PCB Footprint for the EM358x (QFN50P700X700X90-49N).

A ground pad in the bottom center of the package forms a 49th pin.

A 3 x 3 array of non-thermal vias should connect the EM358x decal center shown in Figure 6.3 to the PCB ground

plane through the ground pad. In order to properly solder the EM358x to the footprint, the Paste Mask layer should

have a 3 x 3 array of circular openings at 1.015 mm diameter spaced approximately 1.625 mm (center to center)

apart, as shown in Figure 6.4. This will cause an evenly distributed solder flow and coplanar attachment to the

PCB. The solder mask layer (illustrated in Figure 6.5) should be the same as the copper layer for the EM358x

footprint.

For more information on the package footprint, please refer to the appropriate

EM358x Reference Design.

Figure 6.3. PCB Footprint for the EM358x

Figure 6.4. Paste Mask

MIN

MAX

TYP

6.85

0.30

5.35

0.90

5.35

0.50

* Dimensions in mm

* Dimensions are for

Figures 19-2, 19-3

and 19-4

Via Drill DIA = 0.254mm

1.80

1.625

1.80

1.625

0.75

DIA = 1.01mm

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